| Share | Phrase |
|---|
| 53.64% | laid-open [physical/chemical] publication |
| 17.62% | laid-open [physical/chemical] hei |
| 13.22% | laid-open [physical/chemical] application |
| 6.38% | laid-open [physical/chemical] sho |
| 2.81% | laid-open [physical/chemical] patent |
| 2.48% | laid-open [physical/chemical] specification |
| 1.51% | laid-open [physical/chemical] kokai |
| 0.86% | laid-open [physical/chemical] toku-kai-hei |
| 0.75% | laid-open [physical/chemical] print |
| 0.68% | laid-open [physical/chemical] number |